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Alternatives and similar models for Iceberg FUZEIce thermal paste 11.25 W/m·K

Iceberg FUZEIce thermal paste 11.25 W/m·K Photo 1

Based on this product's specifications, here are some alternatives and similar models

Thermal paste Iceberg FUZEIce 11.25 W/m·K, 3.5 g — heat sink compound
Summary description: Iceberg FUZEIce thermal paste is a heat sink compound with thermal conductivity of 11.25 W/m·K and density 2.6 g/cm³. Supplied in a 3.5 g tube, it is intended for filling microgaps between CPU/GPU and cooler to improve heat transfer. Suitable for desktop CPUs, GPUs, and other electronics requiring thermal interface material.
Manufacturer: Iceberg
Category: Thermal Paste
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iceberg thermal
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Thermal paste Iceberg Thermal FUZEIce Plus
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iceberg thermal
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Thermal paste Iceberg Thermal FUZEIce Plus
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Grizzly
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Thermal paste ARCTIC MX-4 2019 8.5 W/m·K 4 g
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