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Thermal paste Iceberg FUZEIce 11.25 W/m·K, 3.5 g — heat sink compound
Summary description:
Iceberg FUZEIce thermal paste is a heat sink compound with thermal conductivity of 11.25 W/m·K and density 2.6 g/cm³. Supplied in a 3.5 g tube, it is intended for filling microgaps between CPU/GPU and cooler to improve heat transfer. Suitable for desktop CPUs, GPUs, and other electronics requiring thermal interface material.