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Thermal paste Iceberg FUZEIce Plus — 13 W/m·K, 7 g thermal compound
Summary description:
Iceberg FUZEIce Plus is a thermal paste (thermal compound) with thermal conductivity of 13 W/m·K and density 2.6 g/cm³, supplied as a 7 g tube. It is designed to improve heat transfer between CPU/GPU and heatsink, reduce operating temperatures and ensure stable thermal contact. Suitable for desktop processors, graphics cards and other electronic components requiring thermal interface material.