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AiO.lv Heat Sink Compound Qoltec 51632 Thermal Paste High Conductivity Similar products

Alternatives and similar models for Heat Sink Compound Qoltec 51632

Heat Sink Compound Qoltec 51632 Photo 1

Based on this product's specifications, here are some alternatives and similar models

Heat Sink Compound Qoltec 51632 Thermal Paste High Conductivity
Summary description: Qoltec 51632 is a high-performance heat sink compound designed for efficient thermal conductivity. It enhances heat transfer between components, ensuring optimal performance and longevity of electronic devices. Ideal for CPUs GPUs and other heat-generating components.
Manufacturer: QOLTEC
Category: Thermal Paste
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Heat Sink Compound Qoltec 51644
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Thermal paste QOLTEC 51653, thermal conductivity 4.63 W/m·K, 30 g, grey
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Thermal paste QOLTEC 51651, thermal conductivity 4.63 W/m·K, 0.5 g, grey
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Thermal paste QOLTEC 51651, thermal conductivity 4.63 W/m·K, 0.5 g, grey
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Thermal paste QOLTEC 51656, thermal conductivity 5.15 W/m·K, 5 g, grey
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Thermal paste QOLTEC 51656, thermal conductivity 5.15 W/m·K, 5 g, grey
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Thermal paste QOLTEC 51646 — thermal conductivity 3.17 W/m·K, weight 0.5 g
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Thermal paste QOLTEC 51650 — thermal conductivity 4.63 W/m·K, grey, 1 g
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Thermal paste QOLTEC 51655 — thermal conductivity 5.15 W/m·K, 1 g, grey
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Thermal paste QOLTEC 51655 — thermal conductivity 5.15 W/m·K, 1 g, grey
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Thermal paste QOLTEC 51645 — thermal conductivity 3.17 W/m·K, 1 g, silver
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