Based on this product's specifications, here are some alternatives and similar models
Thermal pad Gelid TP-GP01-C, 80×40×1.5 mm, density 2.8 g/cm³, 1 pc
Summary description:
Gelid TP-GP01-C is a thermal pad for heat transfer between components and heatsinks. Dimensions are 80 × 40 × 1.5 mm with a density of 2.8 g/cm³. Supplied as a single pad, it fills small gaps, improves thermal contact for chips, MOSFETs or VRMs, and is suitable for PC cooling and electronic assemblies.