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Thermal pad Gelid TP-GP04-D, thermal interface pad 90×50×2 mm, density 3.2 g/cm³, 1 pc
Summary description:
Gelid TP-GP04-D is a thermal pad designed for use as a thermal interface between components and heatsinks. It measures 90 × 50 × 2 mm with a density of 3.2 g/cm³ and comes as a single piece per pack. Suitable for improving heat transfer in electronics, it fills gaps, reduces thermal resistance and is easy to cut and apply for CPU, GPU, VRM or power module cooling.