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Thermal pad Gelid TP-GP04-R-E 120×20×3.0 mm, density 3.2 g/cm³, 1 pc
Summary description:
Thermal pad Gelid TP-GP04-R-E is a 120×20×3.0 mm thermal interface pad with a density of 3.2 g/cm³, supplied as 1 piece. It provides a compliant thermal connection between components and heatsinks, filling gaps up to 3 mm. Suitable for cooling tasks in PCs and electronics where reliable heat transfer and gap filling are required. Do not open or attempt self-repair.