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Thermal pad Gelid TP-VP04-B, 90×50×1 mm, density 3.2 g/cm³, pack of 2
Summary description:
Gelid TP-VP04-B is a thermal pad designed for heat transfer between components and heatsinks. Size 90×50×1 mm and density 3.2 g/cm³ provide a compliant interface for CPUs, chipsets, VRMs, and other electronic components. Supplied as two pads per pack, it fills gaps, reduces thermal resistance, and simplifies installation where a pre-cut thermal pad is required.